Focused Ion Beam Equipped High Resolution Schottky FE-SEM with an Extra Large Chamber and Variable Pressure SEM Operation.
The LRYA FIB-SEM has a fully integrated software control SEM/FIB/GIS for all jobs, a powerfull DrawBeam lithography module for pattern programming and contains optimized microanalytical ports. Availabel as HiVac (High Vacuum) or variable pressure UniVac (High and Low Vaccum).
SEM Specific Features
Unique three-lens Wide Field Optics™ design offering the variety of working and displaying modes embodying the TESCAN proprietary Intermediate Lens for beam aperture optimization
High Brightness Schottky field emitter for high resolution, high current, low noise imaging
Real time In-Flight Beam Tracing™ for the performance and beam optimization integrating the well established software Electron Optical Design. It also includes direct and continual control of beam spot size and beam current
Fully automated microscope set-up including electron optics set-up and alignment
Variable pressure mode on UniVac model for observation of nonconductive specimens, allowing investigation of non-conductive specimens in their natural uncoated state.
Fast imaging rate using first class YAG detectors
Live stereoscopic imaging for accurate 3D navigation
Network operations and built-in remote access/diagnostics
Five-axis fully motorized compucentric stage with extra wide range of movements
TESCAN LYRA Chamber Specifications
XM
GM
Internal Diameter
300 x 340 mm (w,d)
340 x 310 mm (w,d)
Door Width
285 x 320 mm (w,h)
340 x 320 mm (w,h)
Type
compucentric
compucentric
X
130 mm mot.
130 mm mot.
Y
130 mm mot.
130 mm mot.
Z
100 mm mot.
100 mm mot.
Rotation
360° mot.
360° mot.
Tilt
-30 to +90° mot.
-30 to +90° mot.
Specimen Hight
139 mm max.
145 mm max.
Ports
12+
20+
TESCAN LYRA FE-FIB-SEM Specifications
Chamber & Vacuum
XMH / XMU / GMH / GMU
Column
SEM
FIB
Electron / Ion Gun
High Brightness Schottky Emitter
Ga Liquid Metal Ion Source
Resolution (SE)
1.2 nm at 30 kV
< 2.5 nm at 30 kV (Cobra) < 5 nm at 30 kV (Canion)
Vacuum
FIB Gun
—
< 5*10-6 Pa
High Vacuum Mode
< 9*10-3 Pa
—
Low Vacuum Mode (only in U-variant)
7-150 Pa
—
Working Modes
Resolution, Depth, Wide Field, Field, Channelling, 3D Beam - Live Stereoscopic Imaging, E-Beam Induced Deposition*, Lithography
