LYRA Focused Ion Beam FE-REM

Focused Ion Beam FE-SEM

Focused Ion Beam Equipped High Resolution Schottky FE-SEM with an Extra Large Chamber and Variable Pressure SEM Operation.
 
The LRYA  FIB-SEM  has a fully integrated software control SEM/FIB/GIS for all jobs, a powerfull DrawBeam lithography module for pattern programming and contains optimized  microanalytical ports. Availabel as HiVac (High Vacuum) or variable pressure UniVac (High and Low Vaccum).
 

SEM Specific Features

Unique three-lens Wide Field Optics™ design offering the variety of working and displaying modes embodying the TESCAN proprietary Intermediate Lens for beam aperture optimization

High Brightness Schottky field emitter for high resolution, high current, low noise imaging

Real time In-Flight Beam Tracing™  for the performance and beam optimization integrating the well established software Electron Optical Design. It also includes direct and continual control of beam spot size and beam current

Fully automated microscope set-up including electron optics set-up and alignment

Variable pressure mode on UniVac model for observation of nonconductive specimens, allowing investigation of non-conductive specimens in their natural uncoated state.

Fast imaging rate using first class YAG detectors

Live stereoscopic imaging for accurate 3D navigation

Network operations and built-in remote access/diagnostics

Five-axis fully motorized compucentric stage with extra wide range of movements

TESCAN LYRA Chamber Specifications

XM

GM

Internal Diameter

290 x 340 mm (w,d)

340 x 315 mm (w,d)

Door Width

290 x 322 mm (w,h)

340 x 320 mm (w,h)

Type

compucentric

compucentric

X

130 mm mot.

130 mm mot.

Y

130 mm mot.

130 mm mot.

Z

100 mm mot.

100 mm mot.

Rotation

360° mot.

360° mot.

Tilt

-30 to +90° mot.

-60 to +90° mot.

Specimen Hight

141 mm max.

141 mm max.

Ports

12+

20+

TESCAN LYRA  FE-FIB-SEM Specifications

Chamber & Vacuum

XMH / XMU / GMH / GMU

Column

SEM

FIB

Electron / Ion Gun

High Brightness Schottky Emitter

Ga Liquid Metal Ion Source

Resolution (SE)

1.2 nm at 30 kV **

< 2.5 nm at 30 kV (Cobra)
< 5 nm at 30 kV (Canion)

Vacuum

FIB Gun

 —

< 5*10-6 Pa

High Vacuum Mode

< 9*10-3 Pa

 —

Low Vacuum Mode
(only in U-variant)

7-500 Pa

 —

Working Modes

Resolution, Depth, Wide Field, Field, Channelling,
3D Beam - Live Stereoscopic Imaging, E-Beam Induced Deposition*, Lithography

Imaging, SEM-FIB simultaneous imaging, Etching, Polishing, Selective etching*, I-Beam Induced Deposition*

Magnification

1 to 1,000,000x

150 to 1,000,000x

Accelerating Voltage

200 V to 30 kV

500 V to 30 kV

Probe Current

2 pA to 200 nA

1 pA to 40 nA

Requirements

230 V / 50 Hz or 120 V / 60 Hz, 2300 VA, No Water Cooling, Compressed Air 600 - 800 kPa, Compressed Nitrogen for Venting 150 - 500 kPa

* only if GIS option installed
 
** Resolution for LYRA FE-SEM models with BDT (Beam Deceleration Technology) available on request.
 
Wide Field Optics™ and In-Flight Beam Tracing™ are trademarks of Tescan, a.s.
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