The most important features of the MIRA Series are:
High brightness Schottky emitter for high-resolution / high-current / low-noise imaging.
Unique three-lens Wide Field Optics™ design offering the variety of working and displaying modes embodying the Tescan proprietary Intermediate Lens for the beam aperture optimisation.
Real time In-Flight Beam Tracing™ for the performance and spot optimisation integrating the well established software Electron Optical Design.
Fast imaging rate.
High-throughput large-area automation, e.g. automated particle location and analyses.
Extraordinary analytical potential - up to 11 chamber ports with optimised analytical geometry allowing simultaneous EDX, WDX and EBSD.
Fully automated microscope set-up including electron optics set-up and alignment.
Sophisticated software for SEM control, image acquisition, archiving, processing and analysis.
Network operations and built-in remote access/diagnostics, all come as the Tescan standard.
LM
XM
Internal diameter
Ø 230 mm
300 x 330 mm
Door Width
148 mm
280 mm
Type
compucentric
compucentric
X
80 mm mot.
130 mm mot.
Y
60 mm mot.
130 mm mot.
Z
47mm mot.
100 mm mot.
Rotation
360° mot.
360° mot.
Tilt
-80 to +80° mot.
-30 to +90° mot.
Chamber type
LM-, XM-
Type
H
U
Resolution High Vacuum Mode (In-Beam SE)
Low Vacuum Mode (LVSTD)
1 nm at 30 kV 1,2 nm at 15 kV 2 nm at 3 kV 3,5 nm at 1 kV -
1 nm at 30 kV 1,2 nm at 15 kV 2 nm at 3 kV 3.5 nm at 1 kV 1,5 nm at 30 kV
Working Vacuum High Vacuum Mode (chamber) Low Vacuum Mode (chamber)
230 V / 50 Hz or 120 V / 60 Hz, 1300 VA, No water cooling
Wide Field Optics™ and In-Flight Beam Tracing™ are trademarks of Tescan, a.s. Windows™ is a trademark of the Microsoft Corporation USA and other countries.
