The TESCAN VEGA Series is a family of fully PC-controlled state-of-the-art SEM with a host of advanced features, combined with modern design, excellent quality of control electronics and mechanics at a very competitive price/performance ratio.   The VEGA series was designed with respect to a wide range of SEM applications and needs in today’s research and industry. After ten years of continuous development VEGA has matured into its 3rd Generation.   A lot of additional accessories from load lock system up to nanomanipulators are available for the VEGA series.   click to enlarge Key features of the VEGA3 Generation High-performance electronics for faster image acquisition and signal processing Ultra-fast scanning system with compensated static and dynamic image aberrations An extended range of scanning modes using the original Wide Field Optics™ Unique In-Flight Beam Tracing™ for real-time beam optimization Redesigned software control with high level of automation Built-in scripting for user-defined applications Extra-long filament life-time   TESCAN VEGA Series Choises four chamber types SB-, LM- or XM-Chamber (plus special GM-Chamber) two vacuum systems High Vacuum (H) or Uni Vacuum (U) for High or Low Vacuum two cathode systems Tungsten or LaB6 Cathode three table options Short-, Standard- or Extended-Table More features of the VEGA3 Generation Unique 4-lens electron optical system (up to 30 kV), PC-controlled to easily switch between modes for high resolution imaging, ultra-low magnification, ultra-high depth of focus and optimised analysis Effective automatic functions to control and optimise electron optical parameters, and/or to automate working procedures for fast high-quality results Fast and easy 3D stereo imaging via PC-controlled beam deflection with optional 3D surface modelling and analysis Sophisticated user interface, easy-to-use software for microscope control under MS Windows™ operating system Password-protected, multi-level user accounts Comprehensive software for image archiving, measurement, processing, and analysis Variable pressure option (LV-/VP-systems with 500 or 2000 Pa) Full range of detectors (i.e. BSE, LVSE, etc.), accessories and options Full integration of analytical systems via TCP/IP remote access   TESCAN VEGA Chamber Specifications SB LM XM Int. Diameter Ø 160 mm Ø 230 mm 285 x 340 mm (w,d) Door Width 120 mm 148 mm 285 x 320 mm (w,h) Type eucentric compucentric compucentric X 45 mm mot. 80 mm mot.* 130 mm mot. Y 45 mm mot. 60 mm mot.* 130 mm mot. Z 27 mm man. 47mm mot. 100 mm mot. Z’ 6 mm man. — — Rotation 360° mot. 360° mot. 360° mot. Tilt -90 to +90° man. -80 to +80° mot. -30 to +90° mot. Spec. Hight 36 mm max. 81 mm max. 145 mm max. VEGA SEMs also available with special GM multi-port chamber * Also available with other measurements   TESCAN VEGA SEM Specifications Chamber Type SB- / LM- / XM- Vacuum Type H U   Resolution     High Vaccum Mode 3.0 nm (2.0 for LaB6) 3.0 nm (2.0 for LaB6) Low Vacuum Mode  — 3.5 nm (2.5 for LaB6)   Vacuum     High Vacuum Mode < 9*10-3 Pa < 9*10-3 Pa Low Vacuum Mode  — 3 - 500 Pa (optionally 2000 Pa) Working Modes Resolution, Depth, Field, Wide Field, Rocking Beam Magnification about 1.5 to 1.000.000x (depending on chamber) Detectors Standard SE, Touch Alarm, Probe Current Measruement SE, BSE, Touch Alarm, Probe Current Measruement Detectors Optional TE, EBIC, EBSD, EDX, WDX*, BSE, Chamberscope ... TE, EBIC, EBSD, EDX, WDX*, LVSTD (to 500 Pa), Chamberscope ... Accelerating Voltage 200 V to 30 kV Electron Gun Tungsten Heated Cathode or LaB6 Cathode Probe Current 1 pA to 2 µA Requirements 230 V / 50 Hz or 120 V / 60 Hz, 1300 VA, No Water Cooling * WDX only with LM or XM Chamber   Wide Field Optics™ and In-Flight Beam Tracing™ are trademarks of Tescan, a.s. Windows™ is a trademark of the Microsoft Corporation USA and other countries.