Scanning Electron Microscope with an Extra Large Chamber and Variable Pressure SEM Operation.
The VELA FIB-SEM system combines the imaging qualities of the Scanning Electron Microscope with the possibility of surface modification by a focused ion beam. It has a fully integrated software control SEM/FIB/GIS for all jobs, a powerfull DrawBeam lithography module for pattern programming and contains optimized microanalytical ports.
SEM Specific Features
A unique four-lens Wide Field Optics™ design offering the variety of working and displaying modes embodying the Tescan proprietary Intermediate Lens for beam aperture optimization
Fast imaging rate, using first class YAG detectors
Real time In-Flight Beam Tracing™ for the performance and beam optimization integrating the well established software Electron Optical Design
Variable pressure mode (UniVac model) for observation of nonconductive specimens in their natural uncoated state
Fully automated microscope set-up including electron optics set-up and alignment.
Five-axis fully motorized compucentric stage with extra wide range of movements
Network operations and built-in remote access/diagnostics, all Tescan standard
Live stereoscopic imaging for accurate 3D navigation
TESCAN VELA Chamber Specifications
XM
GM
Internal Diameter
285 x 340 mm (w,d)
340 x 310 mm (w,d)
Door Width
285 x 320 mm (w,h)
340 x 320 mm (w,h)
Type
compucentric
compucentric
X
130 mm mot.
130 mm mot.
Y
130 mm mot.
130 mm mot.
Z
100 mm mot.
100 mm mot.
Rotation
360° mot.
360° mot.
Tilt
-30 to +90° mot.
-30 to +90° mot.
Specimen Hight
139 mm max.
139 mm max.
Ports
12+
20+
TESCAN VELA W-FIB-SEM Specifications
Chamber & Vacuum
XMH / XMU / GMH / GMU
Column
SEM
FIB
Electron / Ion Gun
Tungsten H. Cathode
Ga Liquid Metal Ion Source
Resolution (SE)
3.5 nm at 30 KV
< 2.5 nm at 30 kV (Cobra) < 5 nm at 30 kV (Canion)
Vacuum
FIB Gun
—
< 5*10-6 Pa
High Vacuum Mode
< 9*10-3 Pa
—
Low Vacuum Mode (only in U-variant)
7-500 Pa (7-150 Pa)
—
Working Modes
Resolution, Depth, Wide Field, Field, Channelling, 3D Beam - Live Stereoscopic Imaging, E-Beam Induced Deposition*, Lithography
